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Let You In: Semiconductor Interview Questions for Majors and Jobs, Latest Edition
Let You In: Semiconductor Interview Questions for Majors and Jobs, Latest Edition
Description
Book Introduction
#1 bestseller for 4 consecutive years!
The latest edition has been updated and strengthened with additional questions from major semiconductor equipment companies!
Analysis of 1,920 past major interview questions from the eight major semiconductor companies over the past eight years!
Includes 225 questions and model answers on components, 8 major processes, testing and packaging, and equipment!

『Complete Major/Job Interviews in One Book: Semiconductor Past Questions』 is the representative book of the [Complete Major/Job Interviews in One Book] series, which organizes job/major theories of major industries in the science and engineering field with the purpose of 'preparing interview answers'. The content is organized so that test takers preparing for major/job interviews can study efficiently in a short period of time.

We analyzed actual interview questions from semiconductor companies, including Samsung and SK Hynix, over the past eight years, from 2016 to 2023, in collaboration with current and former engineers who were interviewers. We selected 225 representative past questions for each job and compiled model answers.
In particular, in line with the increasing trend of job seekers hoping to work for semiconductor equipment manufacturers, we added past exam questions from six major equipment manufacturers (Applied Materials/ASML/TEL (Tokyo Electron)/Lam Research/Semes/Wonik IPS) to reflect the trends in the semiconductor employment market.


In addition, [3-step answer structure] is included, so you can write your own answer based on the structured content first, and then compare it with the model answer to learn only the missing content. For job seekers who are preparing for an interview but feel that they are lacking in organizing theories, only the core theories that must be learned to prepare for an interview answer are organized and included in one book.
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index
PART 1 Semiconductor Devices

Chapter 1 Energy Bands and Semiconductor Materials
Chapter 2 PN Junction
Chapter 3 MOSFET
Chapter 4 MOSFET Miniaturization and Short Channel Effect
Chapter 5 MOSFET Element Technology
Chapter 6 DRAM
Chapter 7 NAND Flash
Chapter 8 Memory Comparison and Next-Generation Memory

PART 2 Semiconductor Process

Chapter 1 Process Basics
Chapter 2 Plasma Basics
Chapter 3 Photolithography
Chapter 4 Etch Process
Chapter 5 Thin film process
Chapter 6 Metallization
Chapter 7 Oxidation
Chapter 8 Ion Implantation
Chapter 9 CMP process (CMP, Chemical-Mechanical Polishing)
Chapter 10 Cleaning Process

PART 3 Semiconductor Testing and Packaging Processes

Chapter 1 Semiconductor Test Process
Chapter 2 Semiconductor Packaging Process

PART 4 ​​SEMICONDUCTOR EQUIPMENT

Chapter 1 Applied Materials
Chapter 2 ASML
Chapter 3 TEL (Tokyo Electron)
Chapter 4 Lam Research
Chapter 5 Semes
Chapter 6 Wonik IPS

Detailed image
Detailed Image 1Detailed Image 2
GOODS SPECIFICS
- Date of issue: October 30, 2023
- Page count, weight, size: 564 pages | 188*257*25mm
- ISBN13: 9791192388335
- ISBN10: 119238833X

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