01 Aperçu des semi-conducteurs
Aperçu de la technologie de fabrication des semi-conducteurs·····················································5

01.
Définition de semi-conducteur············································································· 7
Qu'est-ce qu'un semi-conducteur ?·······································································7
Types de semi-conducteurs ································································8

02.
Histoire des semi-conducteurs················································································ 9
Transistor ·····································································9
Mémoire ······································································································ 12
La Corée du Sud, leader mondial des semi-conducteurs de mémoire················ 15

03.
Semiconducteurs de mémoire du futur· ...
Marché de la mémoire· ...
Limitations techniques·························································································· 18
Produits PCRAM··················································································20
Produits ReRAM ·····························································································25
Produits STT-MRAM··············································································27
Résumé···········································································································31


02 Produits de mémoire DRAM

01. Introduction à la mémoire DRAM························································37
Qu'est-ce que la DRAM ? ··············································································37
Caractéristiques spécifiques du produit de fonctionnement de la DRAM·······························································39

02. Introduction aux opérations de base de la DRAM·················································································· 41
MOSFET· ...
Architecture DRAM ······························································45
Introduction aux mouvements principaux·············································································48
Comprendre les opérations SWD et S/A········································································52
RAFRAÎCHIR ·· ...

03. Module de traitement principal DRAM··············································57
ISO / PORTE·························································································57
SAC·····················································59
SN······················································ 61
MLM·····························································62

04. Sens des changements de la DRAM······················································································64
Demande de changements dans la technologie de mémoire DRAM····································64


03 Produits de mémoire NAND

01. Introduction à la mémoire flash NAND·············································73
Qu'est-ce que la mémoire FLASH ? 73
Tendances du marché de la mémoire FLASH··················································· 76

02. Introduction aux opérations de base de la mémoire flash NAND···············79
Architecture NAND·····························································79
Opération d'effacement/lecture/écriture····························································83
Forme cellulaire et structure des chaînes
ISPP · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · 97
Distribution des cellules et cellules multi-bits ·······························99

03.
Introduction à l'architecture NAND 3D···················································································· 103
Mémoires NAND 2D et 3D·······························································103
Structure PUC················································································106
CTF·····································································107
Avec ou sans tuyaux ··············································································· 110
Séquence de processus 3D NAND·······································································111

04.
Processus de clés 3D NAND·········································································· 115
PLUG······································································· 115
ONOP... 119
SLIM······································································· 121

05.
Mémoire flash NAND future··········································································· 123
3D Re-NAND··············································································123
3D Fe-NAND···············································································124
SGVC · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · 124


04 Procédé de diffusion_four

01.
Introduction à la diffusion· ...
Définition de la diffusion·········································································132
Introduction aux processus et matériaux représentatifs de la diffusion····································133
Introduction aux équipements représentatifs de Diffusion············································137

02.
Comprendre le processus du four·········································································142
Introduction au processus de diffusion···················································142
Introduction au processus d'oxydation··················································142
LPCVD... 149
Procédé ALD...........................................................................................160

03.
Comprendre l'équipement des fours ·················································································· 170
Introduction aux équipements de fournaise······················································ 170
Équipement de traitement par lots····························································································· 171
Introduction à l'équipement de la chambre···················································· 179

04.
Introduction à la gestion des procédés et des équipements·····································································186
Gestion de l'utilisation des systèmes informatiques·······························································186
PM······················································ 186

05.
Défis technologiques futurs······································································188


05 Diffusion (implant ionique)

01.
Aperçu du processus d'implantation ionique············································· 195
Historique et définition des procédés d'implantation ionique··············· 195
Procédés clés liés à l'implantation ionique···································197
Principaux équipements pour le procédé d'implantation ionique······························198
Principaux composants de l'équipement d'implantation ionique·····························200

02. Application d'implantation ionique DRAM/NAND···························200
Formation du puits·······································································201
Ajustement du seuil de l'implant·······························································202
Implant source/drain···································································202
Drain légèrement dopé···························································203

03.
Configuration et matériel d'implantation ionique··················205
Composition du gaz ······················································································205
Configuration matérielle de base···················································································208

04.
Physique de l'implantation ionique··························· 217
Phénomène de diffusion················································································· 218
Mécanisme d'arrêt·········································································· 218
Portée de projection des ions·····························································221
Effet de canalisation····························································222
Effet d'ombrage···························································224
Ingénierie des dommages·······························································225
Recuit·····························································227
Introduction et caractéristiques des RTA·············································································228
Méthodes de surveillance après implantation ionique····················································230

05.
Technologies futures liées à l'implantation ionique···········································232
Implantation à chaud et à froid·····························································232
Dopage plasma·······························································233
Co-implantation·······················································235
Recuit avancé····························································237


Procédé de dépôt chimique en phase vapeur (CVD) en couches minces 06

01. Introduction au procédé CVD ················································································245
Définition du procédé CVD················································································246

02. Rôle et compréhension du processus CVD·····················································248
Rouleau de film isolant··············································································248
Caractéristiques de remplissage des espaces
Rôle de HARD MASK······························································································252
Film isolant à faible constante diélectrique···············································································253

03. Comprendre les équipements de fabrication CVD
Caractéristiques de la gestion des équipements·············································································255
Comprendre les caractéristiques des composants clés······························································257

04. Introduction aux principaux équipements du procédé CVD································································263
Procédé PE CVD USG·····································································263
Procédé BPSG CVD thermique··················································································264
Procédé PE CVD ARC············································································266
Procédé HDP ····················································································268
Processus SOD..................................................................................271
Procédé de nitruration PE··············································································273
Procédé de masque dur ACL······································································273
Procédé à faible k···············································································275
Processus CND..........................................................................................276
Processus de pile Gate ON········································································277

05. Tendances futures des équipements CVD·····································································278


07 Procédé de dépôt physique en phase vapeur (PVD) en couches minces

01. Procédé PVD··········································································285
Introduction au procédé PVD···············································································285

02. Exigences du procédé PVD··············································································286

03.
Caractéristiques des matériaux métalliques···········································································286
Matériau en aluminium················································································287
Matériau en titane···············································································287
Matériau en tungstène · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · 288
Matériau au cobalt·················································································289
Substance de tantale···············································································289
Matériau en cuivre·································································290

04. Comprendre les caractéristiques clés du PVD·······································································290
Résistance de surface······························································290
Caractéristiques du siliciure de contact ···································································291
Phénomène EM··························································································292
Méthode ALD···················································································293
Structure Damascène · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · 293

05. Comprendre les équipements de fabrication de procédés PVD···············294
Équipement de procédé de pulvérisation cathodique·····································································296
Silicide de contact·········································································300
Équipement ALD TiN·················································································302
Équipement CVD W···················································································304
Équipement LFW···················································································307
Équipement EP Cu · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · 309
Équipement métallique barrière en cuivre······································································ 312

06. Tendances futures des procédés PVD······················································ 314


08 Traitement photo

01.
Le rôle du traitement photographique·······································································321
Introduction au processus photographique·······································································321
Comprendre le processus photographique····························································322
Types de matériel photographique········································································324
Matériaux utilisés pour la photo································································328

02.
Procédé photographique··························································································330
Imagerie··············································· 330
Focus················································ 336
Dose······················· 338
Nivellement······································· 339
Superposition·············································· 339
Alignement· ...
Superposition· ...
Contrôle de superposition·················································· 348
MASQUE······························ 353
Photorésine...357

03.
Matériel photo··································································································363
Piste········································ 363
Scanner······································· 370

04.
Gestion du traitement photographique··············································································377
Superposition·············································· 377
Incell·············································· 379
CD································ 379
Défaut...381

05.
Technologie du futur photographique················································································382
Technologie photographique de nouvelle génération·······················································382
Qu'est-ce que l'EUV ?
Différences par rapport à l'ArF existant····································································387
Problèmes liés à la technologie EUV····································································388


09 Procédé de gravure

01.
Introduction à la gravure· ...
Aperçu de l'ingénierie de gravure en situation réelle ·························397

02.
Principes de base de la gravure········································································402
Procédés de fabrication additive et dispositifs semi-conducteurs··············································402
Principes et mécanismes de la gravure··············································408
Définition et propriétés du plasma····································································· 413
Considérations relatives à la gravure································································· 419
Résultats pour la gestion des processus de gravure···········································431
Gaz et matériaux de gravure ···············································440

03.
Application de gravure et application··················································································444
Gravure du processus structurel représentatif····················································444
Configuration et types d'équipements de gravure················································454
Classification des équipements de gravure par source de plasma·························465

04. Exercices de gravure : Travail d'un ingénieur en gravure dans une usine de production de masse··············· 476
Technologie de production de masse en usine··········································································· 476
Maintenance des équipements de gravure······························································482
Difficultés liées à la gravure en production de masse··································487
Une journée dans la vie d'un ingénieur de production en gravure············································489

05.
Problèmes liés à la gravure et orientations de développement futures·········································490
Tendances en matière de micronisation des semi-conducteurs et problèmes de gravure·······························490
Surmonter les limitations technologiques et orientations du développement technologique·········492


10 Processus de nettoyage

01.
Processus de nettoyage·····························································································507
Introduction au processus de nettoyage ...........................................................................507

02.
Types et caractéristiques des produits chimiques de nettoyage ································· 511
Nettoyage SPM··········································································· 511
Nettoyage APM· ...
Nettoyage DHF / BOE···························································································· 517
Nettoyage à l'acide phosphorique (H3PO4) ····················································520
Nettoyage à l'ozone ············································································521
Nettoyage NFAM···················································································525
Fonction Nettoyage à l'eau··································································527
Nettoyage à sec au gaz HF/NH3····················································531

03.
Types et caractéristiques des équipements de nettoyage ·········································534
Type de lot···························································································534
Type humide simple···················································································537
Type sec simple············································································539
Nettoyage des autolaveuses············································································542

04.
Contrôle de la qualité et gestion des équipements de production dans le processus de nettoyage·······················544
défaut ·· ...
Uniformité ·· ...
Contamination ············································································548
Fumées·····················································································548
Contamination croisée·····································································550
Sélectivité···············································································552
Pencher································································553
Débit· ...
Température···········································································557
Concentration ·············································································································559
Échappement ·· ...
Pression ·· ...

05.
Technologies futures du nettoyage ·····················································565


Procédé CMP 11

01. Introduction au procédé CMP·················································································573

02. Types et caractéristiques des procédés CMP······················578
Planarisation··········································································578
Isolement·······································································580

03. Configuration et caractéristiques de l'équipement CMP· ...
Polisseuse····································································582
Nettoyant····················································································584
EPD·······················································································587

04. Contrôle de la qualité et gestion des équipements de production du procédé CMP···························591
Défaut, rayure·································································591
Uniformité, APC·····································································594
Boue ········································································································································596
Sélectivité············································································599
Creux, Érosion································································600
Bloc-notes ·· ...
Disque ·· ...
Membrane······································································605
Bague de retenue ································································································································609
Brosse ·· ...
Filtre ·· ...

05. Technologies futures de CMP ································································· 613


12 MI (Métrologie et Inspection)

01.
Métrologie ·· ...
Introduction à la métrologie·········································································621
Mesure de l'épaisseur de la couche mince du dispositif·································································621
Mesure de la structure/forme du dispositif····························································626
Mesures de la composition et des propriétés des couches minces····································································631
Mesure de la déflexion······································································638

02.
Inspection···································································639
Introduction à l'inspection···········································································639
Test BF/DF·················································································640
Compteurs de particules················································································643
Inspection macroscopique·············································································645
Inspection par faisceau d'électrons·················································································645

03.
Technologie d'application de l'instrumentation de processus······································································648
Mesures virtuelles..........................................................................648
Tendances et avenir des technologies de mesure et d'essai···········································649


13 Terminologie des semi-conducteurs

Terminologie des semi-conducteurs ·······················································································656

Un important fabricant de semi-conducteurs a déjà publié en 2020 un ouvrage pratique et spécialisé sur le conditionnement et les tests, et ce livre en est la suite.

Je pense que ce livre sera utile à tous ceux qui travaillent dans l'industrie des semi-conducteurs, en particulier à ceux qui souhaitent comprendre les bases de la DRAM et de la NAND, qui sont des semi-conducteurs de mémoire, ainsi que la fabrication (FabFabrication).

Ceux qui sont directement impliqués dans le processus de fabrication et l'équipement des semi-conducteurs et qui ont des questions ou des besoins à ce sujet, ainsi que ceux qui sont impliqués dans les industries des matériaux, des pièces et des équipements qui constituent le fondement de l'industrie des semi-conducteurs.

Et j'espère que cela sera utile aux enseignants qui dispensent des cours aux élèves dans un cadre éducatif, ainsi qu'aux nombreux candidats coréens qui rêvent de devenir les meilleurs experts mondiaux en semi-conducteurs de demain.


Nous regrettons toutefois que, pour des raisons de sécurité industrielle et autres, les auteurs n'aient pas pu transmettre intégralement le contenu qu'ils souhaitaient, et nous vous remercions de votre compréhension.