01 Semiconductor Overview
Overview of Semiconductor Manufacturing Technology···················································5

01.
Definition of semiconductor····································································· 7
What is a semiconductor?···································································7
Types of semiconductors ····························································8

02.
Semiconductor History······································································ 9
Transistor ·································································9
Memory ················································································· 12
South Korea, a global leader in memory semiconductors··············· 15

03.
Future Memory Semiconductors········································································ 17
Memory Market·············································································· 17
Technical limitations··········································································· 18
PCRAM Products··········································································20
ReRAM Products ·········································································25
STT-MRAM Products·······································································27
Summary·······················································································31


02 DRAM Memory Products

01. Introduction to DRAM Memory·····················································37
What is DRAM? ··········································································37
DRAM Operation Product-Specific Features·····························································39

02. Introduction to DRAM Basic Operations······································································· 41
MOSFET·········································································· 41
DRAM Architecture ····························································45
Introduction to the main movements··········································································48
Understanding SWD, S/A Operations···································································52
REFRESH ··········································································································55

03. DRAM Main Process Module············································57
ISO / GATE···············································································57
SAC·····················································59
SN······································ 61
MLM··························································62

04. Direction of DRAM Changes··········································································64
Demand for Changes in DRAM Memory Technology···································64


03 NAND Memory Products

01. Introduction to NAND FLASH Memory··········································73
What is FLASH Memory? 73
FLASH Memory Market Trend················································ 76

02. Introduction to NAND FLASH Basic Operations···············79
NAND Architecture···························································79
Erase/Read/Write Operation·························································83
Cell Shape and String Structure························································93
ISPP························································· 97
Cell Distribution and Multi-bit Cells ······························99

03.
Introduction to 3D NAND Architecture·········································································· 103
2D NAND and 3D NAND···························································103
PUC Structure············································································106
CTF···································································107
Pipe and Pipeless ······································································ 110
3D NAND Process Sequence··································································111

04.
3D NAND Key Process·································································· 115
PLUG································································ 115
ONOP... 119
SLIM································································ 121

05.
Future NAND FLASH Memory·································································· 123
3D Re-NAND·········································································123
3D Fe-NAND··········································································124
SGVC······································································124


04 Diffusion_Furnace Process

01.
Introduction to Diffusion··············································································· 131
Definition of Diffusion·········································································132
Introduction to Diffusion's representative processes and materials···································133
Introduction to Diffusion's representative equipment···········································137

02.
Understanding the Furnace Process·······································································142
Introduction to the Diffusion Process··················································142
Introduction to the Oxidation Process·················································142
LPCVD... 149
ALD process...........................................................................................160

03.
Understanding Furnace Equipment ········································································· 170
Introduction to Furnace Equipment··················································· 170
Batch Equipment············································································· 171
Introduction to Chamber Equipment················································· 179

04.
Introduction to Process and Equipment Management··································································186
Management of Computer System Utilization·····························································186
PM······················· 186

05.
Future Technology Challenges···································································188


05 Diffusion (Ion Implant)

01.
Ion Implantation Process Overview··········································· 195
History and Definition of Ion Implantation Processes·············· 195
Key processes related to ion implantation···································197
Main equipment for the ion implantation process······························198
Main components of the ion implantation equipment·····························200

02. DRAM/NAND Ion Implantation Application··························200
Well Formation···································································201
Threshold Adjust Implant·····························································202
Source/Drain Implant································································202
Lightly Doped Drain························································203

03.
Ion Implantation Configuration and Hardware·················205
Gas composition ················································································205
HW Basic Configuration············································································208

04.
Ion Implantation Physics·························· 217
Scattering phenomenon······································································· 218
Stopping Mechanism································································· 218
Ion Projection Range··························································221
Channeling Effect··························································222
Shadowing Effect························································224
Damage Engineering····························································225
Annealing··························································227
Introduction and Features of RTA········································································228
Monitoring Methods after Ion Implantation··················································230

05.
Future Technologies Related to Ion Implantation·········································232
Cold & Hot Implantation··························································232
Plasma Doping···························································233
Co Implantation·····················································235
Advanced Anneal·························································237


06 Thinfilm_ CVD process

01. Introduction to the CVD Process ·········································································245
Definition of CVD Process············································································246

02. Role and Understanding of the CVD Process··················································248
Insulating film role·········································································248
Gap fill characteristics·········································································251
HARD MASK Role················································································252
Low-k insulating film·········································································253

03. Understanding CVD Manufacturing Fab Equipment···············································254
Equipment Management Characteristics········································································255
Understanding Key Component Characteristics···························································257

04. Introduction to the Main CVD Process Equipment···························································263
PE CVD USG process·································································263
Thermal CVD BPSG process···········································································264
PE CVD ARC process·······································································266
HDP process ················································································268
SOD process..................................................................................271
PE Nitride Process········································································273
ACL Hard Mask Process·································································273
Low-k process··········································································275
NDC process..........................................................................................276
Gate ON Stack Process···································································277

05. Future Trends in CVD Equipment································································278


07 Thinfilm_ PVD process

01. PVD Process····································································285
Introduction to PVD Process·········································································285

02. PVD Process Requirements·······································································286

03.
Characteristics of Metal Materials·······································································286
Aluminum material········································································287
Titanium material·········································································287
Tungsten material·····································································288
Cobalt material·········································································289
Tantalum substance········································································289
Copper material······························································290

04. Understanding the Key Characteristics of PVD··································································290
Sheet Resistance···························································290
Contact Silicide Characteristics ································································291
EM phenomenon·················································································292
ALD method············································································293
Damascene Structure··································································293

05. Understanding PVD Process Fab Equipment···············294
Sputtering Process Equipment··································································296
Contact Silicide····································································300
ALD TiN equipment·········································································302
CVD W equipment···········································································304
LFW Equipment············································································307
EP Cu equipment··········································································309
Cu Barrier Metal Equipment······························································ 312

06. Future Trends in PVD Processes·················································· 314


08 Photo Process

01.
The Role of Photo Process·····································································321
Introduction to the Photo Process····································································321
Understanding the Photo Process···························································322
Types of Photo Equipment···································································324
Materials used in the photo·····························································328

02.
Photo Process··················································································330
Imaging············································ 330
Focus············································· 336
Dose... 338
Leveling······································ 339
Overlay············································ 339
Alignment··········································································· 341
Overlay····································································· 345
Overlay Control··············································· 348
MASK····························· 353
Photo Resist...357

03.
Photo equipment··················································································363
Track············································ 363
Scanner······································ 370

04.
Photo Process Management··········································································377
Overlay············································ 377
Incell······································ 379
CD······························ 379
Defect...381

05.
Photo Future Technology··········································································382
Next-Generation Photography Technology·····················································382
What is EUV···················································································386
Differences from existing ArF································································387
Problems with EUV Technology··································································388


09 Etch process

01.
Introduction to Etch···································································································397
An Overview of Etch Engineering in Real Life ·························397

02.
Etch Basics···································································402
FAB Process and Semiconductor Devices············································402
Principles and Mechanisms of Etch············································408
Definition and properties of plasma······························································· 413
Etch Considerations···························································· 419
Results for Etch Process Management·········································431
Etching gases and etching materials ·············································440

03.
Etch Application and Application·········································································444
Etch representative structural process··················································444
Etch equipment configuration and types··············································454
Classification of Etch Equipment by Plasma Source························465

04. ETCH Practice: ETCH Engineer Work at a Mass Production FAB··············· 476
Mass production technology in the fab·································································· 476
Maintenance of Etch Equipment···························································482
Difficulties with Etch in Mass Production··································487
A Day in the Life of an Etch Production Engineer··········································489

05.
Etch Issues and Future Development Directions········································490
Semiconductor Micronization Trends and Etching Issues······························490
Overcoming Technological Limitations and Directions for Technological Development·········492


10 Cleaning Process

01.
Cleaning process··················································································507
Introduction to the Cleaning Process ...........................................................................507

02.
Types and Characteristics of Cleaning Chemicals ································ 511
SPM Cleaning·································································· 511
APM Cleaning··············································································· 514
DHF / BOE Cleaning········································································· 517
H3PO4, Phosphoric Acid Cleaning·················································520
Ozone cleaning ········································································521
NFAM Cleaning············································································525
Function Water Cleaning································································527
HF/NH3 Gas Dry Cleaning·················································531

03.
Types and Features of Cleaning Equipment ········································534
Batch Type················································································534
Wet Single Type············································································537
Dry Single Type·······································································539
Scrubber Cleaning········································································542

04.
Quality Control and Production Equipment Management in the Cleaning Process·······················544
defect ···································································································································544
Uniformity ·····························································································································546
Contamination ·········································································548
Fume·············································································548
Cross contamination···································································550
Selectivity·········································································552
Leaning·····························································553
Flow Rate·············································································555
Temperature····································································557
Concentration ··································································································559
Exhaust ··············································································································································· 561
Pressure ·······························································································································563

05.
Future Technology in Cleaning ····················································565


11 CMP process

01. Introduction to the CMP Process··········································································573

02. Types and Characteristics of CMP Processes·····················578
Planarization········································································578
Isolation·····································································580

03. Configuration and Features of CMP Equipment··································································································582
Polisher·································································582
Cleaner············································································584
EPD···············································································587

04. Quality Control and Production Equipment Management of the CMP Process··························591
Defect, Scratch······························································591
Uniformity, APC··································································594
Slurry ·······························································································································596
Selectivity········································································599
Dishing, Erosion·····························································600
Pad ······························································································································602
Disk ·····························································································································604
Membrane··································································605
Retainer Ring ··············································································································609
Brush ············································································································································ 610
Filter ······································································································································611

05. CMP's Future Technology ··························································· 613


12 MI (Metrology & Inspection)

01.
Metrology ··············································································································621
Introduction to Metrology·······································································621
Device Thin Film Thickness Measurement······························································621
Device Structure/Shape Measurement··························································626
Thin film composition/property measurements·································································631
Deflection Measurement··································································638

02.
Inspection·······························································639
Introduction to Inspection·······································································639
BF/DF Test··········································································640
Particle Counters·········································································643
Macro Inspection·········································································645
Electron beam inspection············································································645

03.
Process Instrumentation Application Technology···································································648
Virtual Measurements..........................................................................648
Trends and Future of Measurement and Testing Technology·········································649


13 Semiconductor Terminology

Semiconductor Terminology ·················································································656

A comprehensive semiconductor manufacturer already published a practical, expert book on packaging and testing in 2020, and this book is a sequel to that book.

I believe this book will be helpful to everyone working in the semiconductor industry, especially those who want to understand the basics of DRAM and NAND, which are memory semiconductors, and FabFabrication.

Those who are directly involved in the semiconductor manufacturing process and equipment and have questions or need for it, and those who are involved in the materials, parts, and equipment industries that form the foundation of the semiconductor industry.

And I hope this will be helpful to teachers who teach students in educational settings and to many hopefuls in Korea who dream of becoming the world's best semiconductor experts of the future.


However, one regret is that, due to industrial security and other reasons, the authors were unable to fully convey the content they intended, and we ask for your understanding.