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Let You In: Semiconductor Theory: Covering Major and Job Interviews in One Volume
Let You In: Semiconductor Theory: Covering Major and Job Interviews in One Volume
Description
Book Introduction
A five-year bestseller in semiconductor theory and interviews
Let You In's semiconductor book contains the know-how of 34,431 successful applicants in science and engineering and 12,812 successful applicants at Samsung!


- #1 bestseller for 4 consecutive years
- Selected textbooks for majors at Seoul S University
- A book also read by current employees at major semiconductor companies.
- Rating: 10 out of 10

A complete compilation of essential semiconductor theory, based on the latest seven-year interview questions from major semiconductor companies, in a single volume!
It's structured so that even those who are new to semiconductors, those preparing for employment for the first time, or those interested in it can easily understand it!
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index
PART 1: Introduction to Semiconductors

Chapter 01 Understanding Semiconductors
1.
What is a semiconductor?

Chapter 02 Semiconductor Industry and Market
1.
semiconductor market
2.
The semiconductor industry's value chain
3.
Recent semiconductor industry trends

Chapter 03 Semiconductor Employment
1.
Types of Semiconductor Jobs and What Engineers Do by Job Type
2.
To those who dream of becoming a semiconductor engineer

PART 2: Semiconductor Basics

Chapter 01: Basic Physical Electronics for Understanding Semiconductors
1.
Theory of Fundamentals of Matter
2.
Energy band theory

Chapter 02 Semiconductor Basics
1.
Definition of semiconductor
2.
carrier concentration in semiconductors
3.
Carrier movement within a semiconductor

PART 3 SEMICONDUCTOR DEVICES

Chapter 01 Passive Components
1.
passive components
2.
Understanding R, L, and C

Chapter 02 Diode
1. PN Diode
2.
Metal-Semiconductor Junction

Chapter 03 BJT
1. BJT (Bipolar Junction Transistor)
2.
BJT in modern silicon circuits

Chapter 04 MOSFET
1. MOS Capacitor
2. MOSFET
3. MOSFET Scale-down and Short Channel Effect
4.
Latest MOSFET devices

Chapter 05 CMOS Image Sensor
1.
Image Sensor Overview
2. CMOS Image Sensor Overview

Chapter 06 SRAM
1.
Definition of Memory and Memory Hierarchy
2. SRAM structure and principles

Chapter 07 DRAM
1. DRAM structure and principles
2.
Latest DRAM Trends

Chapter 08 NAND Flash
1.
Flash memory structure and principles
2. NAND Flash Structure and Principles
3.
Current NAND flash memory trends and 3D NAND

Chapter 09 New Memory
1.
New Memory Overview
2.
new memory devices

PART 4 ​​SEMICONDUCTOR PROCESS

Chapter 01 Essential Concepts for Understanding Semiconductor Processes
1.
Semiconductor Process Overview
2.
Wafer process
3.
Cleanroom
4.
Process equipment and process parameters
5.
Vacuum
6.
Plasma

Chapter 02 Photolithography
1.
What is the photo process?
2.
Photo Mask
3.
Photo process sequence
4.
Photoresist
5.
UV Exposure
6.
Photo process resolution enhancement technology (RET)
7.
Multiple Patterning
8.
Next-generation lithography technology, EUV (Extreme ultra violet)

Chapter 03 Etching Process
1.
What is the etching process?
2.
Wet etching
3.
Dry etching
4.
Etching characteristics
5.
Dry etching and plasma
6.
Reactive Ion Etch (RIE)
7.
Dry etching of semiconductor thin films
8.
Dry etching equipment
9.
High Density Plasma
10.
Atomic Layer Etch (ALE)

Chapter 04 Thin Film Process
1.
What is a thin film process?
2.
Thin film quality
3.
Physical Vapor Deposition (PVD)
4.
Chemical Vapor Deposition (CVD)

Chapter 05 Metal Wiring Process
1.
What is the wiring process?
2.
Silicide process
3.
Tungsten plug (W plug)
4.
aluminum wiring
5.
Cu electroplating

Chapter 06 Oxidation
1.
What is the oxidation process?
2.
Characteristics and Role of Thermal Oxide Films
3.
Oxide film growth
4.
Oxidation process equipment
5.
nitriding process

Chapter 07 Doping Process
1.
What is the doping process?
2.
diffusion process
3.
Ion implantation process
4.
Epitaxial Growth (Epi.)

Chapter 08 CMP process (CMP, Chemical-Mechanical Polishing)
1. What is the CMP process?
2. CMP process method
3. CMP equipment
4. CMP process characteristics
5. Post-CMP cleaning

Chapter 09 Cleaning Process
1.
What is the cleaning process?
2.
Wafer cleaning
3.
Wet cleaning technology
4.
Dry cleaning technology

PART 5 SEMICONDUCTOR TESTING AND PACKAGING PROCESSES

Chapter 01 Semiconductor Testing Process
1.
The concept of test
2.
Types and characteristics of test equipment
3.
Wafer Test [Electrical Die Sorting (EDS) Test]
4.
Package Test (Final Test)
5.
Yield

Chapter 02 Semiconductor Packaging Process
1.
Packaging process
2.
semiconductor packaging technology

[Appendix] Summary of Essential Theories

Detailed image
Detailed Image 1
GOODS SPECIFICS
- Date of issue: May 7, 2023
- Page count, weight, size: 728 pages | 188*257*28mm
- ISBN13: 9791192388236
- ISBN10: 1192388232

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