Packaging and testing that increase the added value of semiconductors
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Description
Book Introduction
This book is an introduction to semiconductor packaging and testing.
Chapter 1 describes the test equipment and process, and the general test items, and Chapter 2 explains the definition and role of the package, technology development trends, and technology development process.
Chapter 3 classifies the types of packages and describes the characteristics, advantages, and disadvantages of each type.
Chapter 4 explains package design and analysis, noting the differences between package design and chip design and introducing the contents and process of structural, thermal, and electrical analysis to improve design and process efficiency.
Chapter 5 explains the packaging process, introducing the process sequence by type and the progress and meaning of each process.
Chapter 6 introduces the materials used in the packaging process, and Chapter 7 explains the meaning of quality and reliability, as well as the methods and purposes of reliability evaluation items.
Chapter 1 describes the test equipment and process, and the general test items, and Chapter 2 explains the definition and role of the package, technology development trends, and technology development process.
Chapter 3 classifies the types of packages and describes the characteristics, advantages, and disadvantages of each type.
Chapter 4 explains package design and analysis, noting the differences between package design and chip design and introducing the contents and process of structural, thermal, and electrical analysis to improve design and process efficiency.
Chapter 5 explains the packaging process, introducing the process sequence by type and the progress and meaning of each process.
Chapter 6 introduces the materials used in the packaging process, and Chapter 7 explains the meaning of quality and reliability, as well as the methods and purposes of reliability evaluation items.
index
01 Semiconductor
Understanding the test
01.
Semiconductor post-processing ······································································ 5
02.
Types of tests········································································· 8
03.
Wafer Testing ································································· 10
EPM ·········································································································· 13
Wafer burn-in······································································ 13
Test ············································································· 14
Repair·············································································· 15
04.
Package Testing ································································· 16
TDBI·························································· 17
Test ············································································· 18
Appearance inspection·········································································· 18
02 Semiconductor
Definition and Role of Packages
01.
Definition of Semiconductor Package························································· 25
02.
The Role of Semiconductor Packages ·········································· 26
03.
Semiconductor Package Development Trends··············· 28
04.
Semiconductor Package Development Process ······································ 31
03 Semiconductor
Type of package
01.
Classification of semiconductor packages··································································· 39
02.
Conventional Package·······························································41
Plastic Packages - Leadframe Type Packages··························41
Plastic Packages - Substrate-Type Packages ·················· 43
Ceramic package ················································································ 46
03.
Wafer-level packaging············································································ 47
Wafer-level packaging ········································································· 47
Rewiring··········································································· 56
Flip Chips ·························································································· 58
04.
Laminated Package··················································································· 66
Package stacking ··································································· 67
Chip Stacking - Chip Stack with Wire Bonding·············· 70
Through-Si-Via (TSV) - Chip Stack with TSV ·············· 73
05.
System in Package············································································· 86
04 Semiconductor
Package Design and Analysis
01.
Semiconductor Package Design ········································································· 97
02.
Structural Analysis···················································································· 101
Bending Analysis··························································································· 104
Solder Joint Reliability ······································································· 106
Strength Analysis··················································································· 108
03.
Thermal Analysis ·························································································· 109
04.
Electrical Interpretation ······································································113
05 Semiconductor
Packaging process
01.
Conventional Packaging Process·······················································123
Back grinding ····················································124
Wafer cutting·····················································127
Die Attach ·································································131
Interconnection···································································137
Molding···············································································143
Marking·······························································144
Trimming - Lead Frame·························································146
Solder Plating - Lead Frame·····································147
Molding - Lead Frame·························································147
Solder Ball Mounting - Substrate ·······················148
Singulation - Substrate ···············152
02.
Wafer-level packaging process··················································153
Photo Process ·······································································156
Sputtering process ················································· 161
Electroplating process ·················································163
Wet Process - PR Strip and Metal Etching ····················166
Fan-in WLCSP process·························································167
Solder Ball Mounting Process············································168
Flip Chip Bump Process ·························································169
Rewiring process ·································································171
Fan-out WLCSP process·························································172
Silicon Through-Electrode Packaging Process···························· 174
03.
Inspection and Measurement······················································187
Inspection·······························································187
Measurement···············································································192
06 Semiconductor
Packaging materials
01.
Conventional Package Materials···················································· 208
Lead frame ·································································· 208
Substrate············································································ 210
Adhesive························································································· 217
Epoxy Molding Compound···················································· 222
Solder ············································································· 225
Tape········································································· 228
Wire ·········································································· 229
Packaging materials ···································································· 230
02.
Wafer-level packaging materials······························································· 231
Photoresist ············································································· 231
Plating solution····································································· 234
PR Stripper································································· 235
Agent············································································ 237
Sputter Target ································································· 238
Underfill···························································································· 238
Carriers, adhesives, and mounting tapes········································· 240
07 Semiconductor
Package reliability
01.
Meaning of reliability ······················································································ 247
02. JEDEC Standards ······················································································ 248
03.
Life Reliability Testing··········································································· 253
EFR ···································································································································· 253
HTOL ············································································································································· 254
LTOL ··························································································· 255
HTSL ················································································································· 256
LTSL················································· 257
Endurance ······································································································· 257
Data Retention····························································· 258
04.
Environmental Reliability Testing······························································ 259
Preconditioning··························································· 259
TC ·································································································· 263
TS ················································································································ 268
THS········································································· 268
PCTP··············································································269
UHAST ······································································································································ 270
HAST········································································ 271
HALT································································ 272
05.
Mechanical Reliability Testing·········································· 273
Shock.................................................................................274
Vibration··············································································· 275
Bending ····························································· 275
Twist···········································································276
08 Semiconductor
Glossary
Glossary of Terms·································································· 282
Understanding the test
01.
Semiconductor post-processing ······································································ 5
02.
Types of tests········································································· 8
03.
Wafer Testing ································································· 10
EPM ·········································································································· 13
Wafer burn-in······································································ 13
Test ············································································· 14
Repair·············································································· 15
04.
Package Testing ································································· 16
TDBI·························································· 17
Test ············································································· 18
Appearance inspection·········································································· 18
02 Semiconductor
Definition and Role of Packages
01.
Definition of Semiconductor Package························································· 25
02.
The Role of Semiconductor Packages ·········································· 26
03.
Semiconductor Package Development Trends··············· 28
04.
Semiconductor Package Development Process ······································ 31
03 Semiconductor
Type of package
01.
Classification of semiconductor packages··································································· 39
02.
Conventional Package·······························································41
Plastic Packages - Leadframe Type Packages··························41
Plastic Packages - Substrate-Type Packages ·················· 43
Ceramic package ················································································ 46
03.
Wafer-level packaging············································································ 47
Wafer-level packaging ········································································· 47
Rewiring··········································································· 56
Flip Chips ·························································································· 58
04.
Laminated Package··················································································· 66
Package stacking ··································································· 67
Chip Stacking - Chip Stack with Wire Bonding·············· 70
Through-Si-Via (TSV) - Chip Stack with TSV ·············· 73
05.
System in Package············································································· 86
04 Semiconductor
Package Design and Analysis
01.
Semiconductor Package Design ········································································· 97
02.
Structural Analysis···················································································· 101
Bending Analysis··························································································· 104
Solder Joint Reliability ······································································· 106
Strength Analysis··················································································· 108
03.
Thermal Analysis ·························································································· 109
04.
Electrical Interpretation ······································································113
05 Semiconductor
Packaging process
01.
Conventional Packaging Process·······················································123
Back grinding ····················································124
Wafer cutting·····················································127
Die Attach ·································································131
Interconnection···································································137
Molding···············································································143
Marking·······························································144
Trimming - Lead Frame·························································146
Solder Plating - Lead Frame·····································147
Molding - Lead Frame·························································147
Solder Ball Mounting - Substrate ·······················148
Singulation - Substrate ···············152
02.
Wafer-level packaging process··················································153
Photo Process ·······································································156
Sputtering process ················································· 161
Electroplating process ·················································163
Wet Process - PR Strip and Metal Etching ····················166
Fan-in WLCSP process·························································167
Solder Ball Mounting Process············································168
Flip Chip Bump Process ·························································169
Rewiring process ·································································171
Fan-out WLCSP process·························································172
Silicon Through-Electrode Packaging Process···························· 174
03.
Inspection and Measurement······················································187
Inspection·······························································187
Measurement···············································································192
06 Semiconductor
Packaging materials
01.
Conventional Package Materials···················································· 208
Lead frame ·································································· 208
Substrate············································································ 210
Adhesive························································································· 217
Epoxy Molding Compound···················································· 222
Solder ············································································· 225
Tape········································································· 228
Wire ·········································································· 229
Packaging materials ···································································· 230
02.
Wafer-level packaging materials······························································· 231
Photoresist ············································································· 231
Plating solution····································································· 234
PR Stripper································································· 235
Agent············································································ 237
Sputter Target ································································· 238
Underfill···························································································· 238
Carriers, adhesives, and mounting tapes········································· 240
07 Semiconductor
Package reliability
01.
Meaning of reliability ······················································································ 247
02. JEDEC Standards ······················································································ 248
03.
Life Reliability Testing··········································································· 253
EFR ···································································································································· 253
HTOL ············································································································································· 254
LTOL ··························································································· 255
HTSL ················································································································· 256
LTSL················································· 257
Endurance ······································································································· 257
Data Retention····························································· 258
04.
Environmental Reliability Testing······························································ 259
Preconditioning··························································· 259
TC ·································································································· 263
TS ················································································································ 268
THS········································································· 268
PCTP··············································································269
UHAST ······································································································································ 270
HAST········································································ 271
HALT································································ 272
05.
Mechanical Reliability Testing·········································· 273
Shock.................................................................................274
Vibration··············································································· 275
Bending ····························································· 275
Twist···········································································276
08 Semiconductor
Glossary
Glossary of Terms·································································· 282
GOODS SPECIFICS
- Publication date: March 10, 2020
- Page count, weight, size: 332 pages | 914g | 178*245*30mm
- ISBN13: 9791156858577
- ISBN10: 1156858577
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