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Learning semiconductors for the first time
Learning semiconductors for the first time
Description
Book Introduction
Semiconductors, called “the rice of modern industry,”
How much do we know?


Semiconductors are considered so important not only in Korea but also around the world that they are called the "rice of modern industry," and have become an indispensable product in modern industry to the point of even causing industrial wars between countries. We come across them through news media and articles every day, but books on semiconductors are actually difficult to find.
Above all, this book covers semiconductors in a way that anyone can easily understand, with the goal of providing 'explanations that are as easy and friendly as possible.'
We will introduce the various characteristics of silicon, a representative semiconductor material, as well as devices that utilize various properties of semiconductors. We will also look at the actual manufacturing process and the fields and purposes in which they are used. Finally, we will look at the movements taking place at the forefront of semiconductor development and future prospects.
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index
Chapter 1: Semiconductor Basics

001 Semiconductor, an intermediate material between conductors and insulators

002 Various semiconductors ① Types of semiconductors

003 Various Semiconductors ② Representative Semiconductor 'Silicon'

004 Three types of solid silicon: single crystal, polycrystalline, and amorphous

005 Charge carriers in silicon semiconductors ①

'n-type silicon', where free electrons carry charge

006 Charge carriers in silicon semiconductors ②

'P-type silicon', where holes carry charge

007 Movement of electrons and holes in semiconductors

Energy Bands and Belt Theory ①

008 The movement of electrons or holes in semiconductors 'energy

'Band' and 'Band Theory' ②

009 Advanced semiconductors with properties different from silicon

A 'compound semiconductor' composed of two or more types of elements

COLUMN Oxide semiconductors and organic semiconductors

Chapter 2 Semiconductor Devices

010 A 'resistance element' made of an electrically resistive semiconductor that has the property of impeding the flow of electricity.

011 A 'capacitor' made of a semiconductor that temporarily stores charge

012 pn junction, a device that conducts current in one direction

diode

013 Photodiode, a semiconductor device that converts light into electricity

014 Semiconductor device that converts electricity into light

diode

015 Optical semiconductor devices for communication or information processing

semiconductor laser

016 What is a Transistor? Typical Types of Transistors

017 Electron carrier MOS transistor n-channel type

018 P-channel type hole carrier MOS transistor

019 Circuit configuration of mobile devices CMOS

020 pn junction gate transistor JFET

021 Schottky Gate Transistor MESFET

022 Electron and hole transistor Bipolar transistor

The Birth of the COLUMN Transistor

Chapter 3: Semiconductor Integrated Circuits - Logic

023 Components and wiring on semiconductor substrates

Circuit integrated circuit (IC)

024 Differences in various IC structures, substrates, and signals

025 Number of components per chip depending on integration density

Classification of MOS-IC

026 Classification of MOS-ICs according to IC's operating function

027 Mathematical Foundations of Logic Circuits Boolean Algebra

028 Basic components of logic circuits

Gate circuit ① NOT circuit

029 Basic components of logic circuits

Gate circuit ② OR circuit

030 Basic components of logic circuits

Gate Circuit ③ AND Circuit

031 Addition Circuit Addition Circuit

032 Subtraction Circuit Subtraction Circuit

033 Signal size comparison judgment circuit

Comparison circuit and matching circuit

034 Computer's Brain IC MPU

035 Microcomputer Function IC MCU

036 Digital Signal Processing Specialized Processor DSP

037 Application and User IC ASIC

038 User function change logic circuit

Programmable logic 'PLD'

039 IC system IC with system functions

040 Electronic Eye IC CCD

COLUMN The first digital calculator

Chapter 4 Semiconductor Integrated Circuits - Memory

041 Temporary data memory circuit flip-flops and registers

042 Structure of information memory semiconductor

043 Computer main memory device memory DRAM

044 High-speed memory SRAM that does not require memory retention operation

045 Manufacturing Stage Data Entry Memory Mask ROM

046 Flash memory that is remembered even when the power is turned off

047 Increase capacity with the same number of memory cells

multi-value memory

The fundamental principle of column miniaturization: the "scaling law."

Chapter 5 IC Development and Design

048 IC Development Process From Market Research to Shipment

049 IC Hierarchy Design System From Design to Layout

050 IC Component Dimensions and Location Rules Design Standards

051 IC Structure and Electrical Characteristics Design Element Design

052 IC Manufacturing Process Design Process Design

COLUMN The Segmentation of the Semiconductor Chip Manufacturing Industry

Chapter 6: How to Make Silicon Wafers

053 Silicon, an element widely present in the earth's crust

054 Reduction, conversion, and distillation process of silica polycrystalline silicon

055 Single crystal silicon rod growth CZ growth method

056 Single crystal bar cutting and milling wafer processing

057 Gettering process for removing metal impurities

058 Evolution of Silicon Wafers: Epiwafers and SOI

COLUMN Required characteristics for silicon wafers

Chapter 7: IC Manufacturing ① - Preliminary Process

059 IC Manufacturing Process Overview Pre- and Post-processes

060 The first part of the process before device formation ① FEOL

061 The first part of the process before device formation ② FEOL

062 BEOL (Back of Line) before wire formation process

063 Thin film process for forming conductor, insulator, and semiconductor thin films

064 Mask Pattern Transfer Technology Lithography

065 Material film corrosion removal etching

066 Conductive impurity addition technology: thermal diffusion and ion implantation

067 Pushing in various heat treatment technologies,

Reflow, annealing

068 Wafer surface planarization CMP

069 Wafer Washing Cleaning

070 Defective Chip Selection Wafer Inspection and Trimming

COLUMN Clean Room

Chapter 8: IC Manufacturing ② - Post-process

071 Dicing: cutting out chips one by one from a wafer

Chip mount mount in 072 package

073 Chip electrode and package terminal connection wire bonding

074 Chip Packaging Molding

075 Package terminal processing and IC identification lead plating,

Lead forming, history notation

076 Package Type Through-hole (TH) element and surface

SMD (Small-Medium-Density Device)

077 IC shape and characteristic inspection process inspection and selection

COLUMN IC Reliability and Accelerated Testing

Chapter 9: Cutting-Edge Semiconductor Technology

078 Large-diameter silicon wafer, wafer diameter 450 mm

079 MOS transistor speed-up using 'modified silicon technology'

080 New structure MOS transistor

081 The Future of Lithography Technology

① Immersion exposure and double patterning

082 The Future of Lithography Technology

② Extreme ultraviolet (EUV) exposure

083 The Future of Lithography Technology

③ Maskless (ML2) and nano imprint

084 Realization of universal function memory

① Candidate technology for functional memory

085 Realization of universal function memory

② Ferroelectric memory and magnetic memory

086 Realization of universal function memory

③ Phase change memory and resistance change memory

087 Breakthrough with the introduction of new materials

① High-k gate insulating film and metal gate electrode

Breakthrough with the introduction of new materials

②DRAM high-performance capacitance film and low-k interlayer insulating film

COLUMN 'More Moore' and 'More than Moore'

Detailed image
Detailed Image 1

Publisher's Review
Semiconductors, called “the rice of modern industry,”
How much do we know?


Semiconductors are considered so important not only in Korea but also around the world that they are called the "rice of modern industry" and have become an indispensable product in modern industry to the point of even causing industrial wars between countries. We come across them through news media and articles every day, but books on semiconductors are actually difficult to find.
Above all, this book covers semiconductors in a way that anyone can easily understand, with the goal of providing 'explanations that are as easy and friendly as possible.'
We will introduce the various characteristics of silicon, a representative semiconductor material, as well as devices that utilize various properties of semiconductors. We will also look at the actual manufacturing process and the fields and purposes in which they are used. Finally, we will look at the movements taking place at the forefront of semiconductor development and future prospects.

Dreaming of a leap forward for the semiconductor industry

Semiconductors, a key material driving modern scientific and technological civilization, are becoming increasingly important in today's information and communications society, and the semiconductor industry's capabilities are exerting such powerful influence that they are becoming a measure of power.
Accordingly, the author wrote this book to provide a broader audience with a more accessible overview of the basics of semiconductors, particularly silicon and integrated circuits (ICs), which dominate the lives of people around the world.

Semiconductors fall into the intermediate range between conductors and insulators when classifying materials according to electrical conductivity.
In its pure state, it is similar to an insulator, but its electrical conductivity can be increased by adding impurities or other manipulations.
Because of these properties, they are used to control current as needed, and silicon is mainly used as a semiconductor material.
Silicon is a very common element, with a Clarke number of 25.8%, making it the second most abundant element on Earth after oxygen at 49.5%.

This book first focuses on explaining the basic concepts of semiconductors.
We will learn about what semiconductors are, what their properties are, how they work, the types and structures of integrated circuits, the actual manufacturing process, and in what fields and for what purposes they are used.
Finally, we conclude with the movements taking place at the forefront of semiconductor development and future prospects.

I hope that through this book, readers can easily understand semiconductors in general and foster even a little more hope for the future of the semiconductor industry.

A three-dimensional, easy-to-understand story about semiconductors

This book actively utilizes pictures and diagrams to provide a three-dimensional understanding of semiconductor-related information, which is a somewhat specialized field, so that even non-specialists can easily understand it.
First, the first chapter explains the various characteristics of silicon, a representative elemental semiconductor.
In addition, we briefly mention band theory, which is the basis of semiconductor theory.
Next, we will learn about passive and active components, including electrical resistance, which utilizes the various properties of semiconductors.
Here, you can hear a brief explanation of the electrical characteristics of semiconductor devices, as well as light-emitting and light-receiving devices.
Next, we will explain the logic that performs numerical calculations or logical operations in semiconductor integrated circuits (CMOS-IC).
We will also learn about volatile memory and nonvolatile memory, which are semiconductor memory devices that can store information and retrieve it when needed.

Diving deep into the book, you'll gain a glimpse into the diverse processes and product development processes of actual semiconductor manufacturing. Beginning with IC development and design, the book explores silicon wafer manufacturing, the pre- and post-processes of IC manufacturing, and the core technologies and techniques of each field.
Ironically, the ongoing advancement of semiconductor technology has brought many technological barriers to the surface.
To overcome these limitations, the book concludes by examining the ongoing research and development of new materials, new structures, and new processes in the cutting-edge semiconductor field.
GOODS SPECIFICS
- Publication date: December 15, 2022
- Page count, weight, size: 224 pages | 153*225*20mm
- ISBN13: 9791159714603
- ISBN10: 1159714606

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