01 반도체 개요
반도체 제조기술 개요···················································5

01.
반도체 정의····································································· 7
반도체란?···································································7
반도체의 종류 ····························································8

02.
반도체 역사···································································· 9
트랜지스터 ·································································9
메모리 ···································································· 12
세계 메모리 반도체 선도하는 대한민국·························· 15

03.
미래 메모리 반도체························································ 17
메모리 시장······························································ 17
기술적인 한계··························································· 18
PCRAM 제품·····························································20
ReRAM 제품 ····························································25
STT-MRAM 제품·······················································27
요약········································································31


02 DRAM Memory 제품

01. DRAM Memory 소개·····················································37
DRAM이란? ·····························································37
DRAM 운용 제품별 특징·············································39

02. DRAM 기본 동작 소개···················································· 41
MOSFET·································································· 41
DRAM Architecture ··················································45
주요 동작 소개··························································48
SWD, S/A 동작 이해···················································52
REFRESH ·······························································55

03. DRAM 주요 Process Module·········································57
ISO / GATE·······························································57
SAC·········································································59
SN·········································································· 61
MLM·······································································62

04. DRAM 변화 방향···························································64
DRAM Memory 기술 변화 요구···································64


03 NAND Memory 제품

01. NAND FLASH Memory 소개··········································73
FLASH Memory란?···················································73
FLASH Memory Market Trend···································· 76

02. NAND FLASH 기본 동작 소개·········································79
NAND Architecture···················································79
Erase/Read/Write Operation······································83
Cell의 형태 및 String 구조···········································93
ISPP········································································97
Cell 분포 및 Multi bit cell ···········································99

03.
3D NAND 구조 소개···················································· 103
2D NAND와 3D NAND············································103
PUC 구조·······························································106
CTF·······································································107
Pipe와 Pipeless ······················································ 110
3D NAND Process Sequence····································111

04.
3D NAND Key Process··············································· 115
PLUG···································································· 115
ONOP··································································· 119
SLIM····································································· 121

05.
Future NAND FLASH Memory···································· 123
3D Re-NAND·························································123
3D Fe-NAND·························································124
SGVC····································································124


04 Diffusion_Furnace 공정

01.
Diffusion 소개···························································· 131
Diffusion 정의·························································132
Diffusion 대표 공정 및 소재 소개································133
Diffusion 대표 장비 소개···········································137

02.
Furnace공정 이해·······················································142
Diffusion공정 소개··················································142
Oxidation공정 소개·················································142
LPCVD·································································· 149
ALD공정································································160

03.
Furnace 장비의 이해 ··················································· 170
Furnace 장비 소개··················································· 170
Batch 장비····························································· 171
Chamber 장비 소개················································· 179

04.
공정과 장비 관리 소개··················································186
전산 시스템 활용 관리··············································186
PM········································································186

05.
미래 기술 해결 과제······················································188


05 Diffusion (Ion Implant)

01.
Ion Implantation공정 개요··········································· 195
Ion Implantation공정의 역사와 정의··························· 195
Ion Implantation 관련 주요 공정································197
Ion Implantation공정의 주요 장비······························198
Ion Implantation 장비의 주요 구성·····························200

02. DRAM/NAND Ion Implantation Application·················200
Well Formation·······················································201
Threshold Adjust Implant·········································202
Source/Drain Implant··············································202
Lightly Doped Drain················································203

03.
Ion Implantation 구성과 Hardware······························205
Gas 구성································································205
HW 기본 구성·························································208

04.
Ion Implantation Physics············································ 217
Scattering 현상······················································· 218
Stopping Mechanism··············································· 218
Ion Projection Range···············································221
Channeling Effect···················································222
Shadowing Effect···················································224
Damage Engineering···············································225
Annealing······························································227
RTA 도입 및 특징·····················································228
이온주입 후의 Monitoring 방법··································230

05.
Ion Implantation 관련 미래 기술···································232
Cold & Hot Implantation··········································232
Plasma Doping·······················································233
Co Implantation······················································235
Advanced Anneal···················································237


06 Thinfilm_ CVD 공정

01. CVD공정 소개 ····························································245
CVD공정 정의·························································246

02. CVD공정의 역할 및 이해···············································248
절연막 역할····························································248
Gap fill 특성····························································251
HARD MASK 역할···················································252
Low-k 절연막·························································253

03. CVD 제조 Fab 장비의 이해············································254
장비 관리 특성························································255
주요 부품 특성의 이해··············································257

04. CVD 주요 공정 장비의 소개···········································263
PE CVD USG공정····················································263
Thermal CVD BPSG공정··········································264
PE CVD ARC공정····················································266
HDP공정································································268
SOD공정································································271
PE Nitride공정························································273
ACL Hard Mask공정·················································273
Low-k공정·····························································275
NDC공정································································276
Gate ON Stack공정·················································277

05. CVD 장비 향후 Trends·················································278


07 Thinfilm_ PVD 공정

01. PVD공정····································································285
PVD공정 소개·························································285

02. PVD공정의 요구사항····················································286

03.
Metal 물질의 특성·······················································286
Aluminum 물질·······················································287
Titanium 물질·························································287
Tungsten 물질························································288
Cobalt 물질····························································289
Tantalum 물질························································289
Copper 물질···························································290

04. PVD 주요 특성의 이해··················································290
Sheet Resistance····················································290
Contact Silicide 특성················································291
EM 현상·································································292
ALD 방식·······························································293
Damascene 구조·····················································293

05. PVD공정의 Fab 장비의 이해·········································294
Sputter공정 장비·····················································296
Contact Silicide·······················································300
ALD TiN 장비·························································302
CVD W 장비···························································304
LFW 장비·······························································307
EP Cu 장비·····························································309
Cu Barrier Metal 장비·············································· 312

06. PVD공정 향후 Trends·················································· 314


08 Photo 공정

01.
Photo공정의 역할························································321
Photo공정 소개·······················································321
Photo Process의 이해··············································322
Photo 장비의 종류···················································324
Photo에 사용되는 소재·············································328

02.
Photo공정·································································330
Imaging·································································330
Focus····································································336
Dose·····································································338
Leveling·································································339
Overlay··································································339
Alignment······························································ 341
Overlay··································································345
Overlay Control······················································348
MASK····································································353
Photo Resist···························································357

03.
Photo 장비·································································363
Track·····································································363
Scanner·································································370

04.
Photo공정 관리··························································377
Overlay··································································377
Incell·····································································379
CD········································································379
Defect···································································381

05.
Photo 미래 기술··························································382
차세대 Photo Graphy 기술········································382
EUV란···································································386
기존 ArF와의 차이점················································387
EUV 기술의 문제점··················································388


09 Etch 공정

01.
Etch 소개···································································397
실생활에서 본 Etch Engineering 개요 ························397

02.
Etch 기본···································································402
FAB공정과 반도체 소자············································402
Etch의 원리와 메커니즘············································408
플라즈마 정의와 성질··············································· 413
Etch 고려사항························································· 419
Etch공정관리를 위한 결과물······································431
식각 가스와 식각 물질 ·············································440

03.
Etch 적용과 응용·························································444
Etch 대표 구조공정··················································444
Etch 장비 구성과 종류··············································454
Plasma Source에 따른 Etch 장비 구분························465

04. ETCH 실전, 양산 FAB에서 ETCH 엔지니어 업무··············· 476
팹에서의 양산 기술·················································· 476
Etch 장비의 유지 관리··············································482
양산에서 Etch가 가지는 어려움··································487
Etch 양산 엔지니어의 하루········································489

05.
Etch Issue 및 향후 개발 방향········································490
반도체 미세화 트렌트와 식각 이슈······························490
기술적 한계 극복 방안과 기술 발전 방향······················492


10 Cleaning 공정

01.
Cleaning공정······························································507
Cleaning공정 소개···················································507

02.
Cleaning Chemical의 종류와 특징 ································ 511
SPM 세정······························································· 511
APM 세정······························································· 514
DHF / BOE 세정······················································ 517
H3PO4, Phosphoric Acid 세정····································520
Ozone 세정 ···························································521
NFAM 세정····························································525
Function Water 세정················································527
HF/NH3 Gas 건식 세정·············································531

03.
Cleaning 장비의 종류와 특징 ········································534
Batch Type····························································534
Wet Single Type·····················································537
Dry Single Type······················································539
Scrubber 세정························································542

04.
Cleaning공정의 품질 관리와 생산장비 관리····················544
defect ··································································544
Uniformity ····························································546
Contamination ·······················································548
Fume····································································548
Cross contamination···············································550
Selectivity······························································552
Leaning·································································553
Flow Rate······························································555
Temperature··························································557
Concentration ·······················································559
Exhaust ······························································· 561
Pressure ·······························································563

05.
Cleaning의 미래기술 ····················································565


11 CMP 공정

01. CMP공정 소개·····························································573

02. CMP공정의 종류와 특징···············································578
Planarization··························································578
Isolation·································································580

03. CMP 장비의 구성과 특징··············································582
Polisher·································································582
Cleaner··································································584
EPD······································································587

04. CMP공정의 품질 관리와 생산 장비 관리··························591
Defect, Scratch·······················································591
Uniformity, APC······················································594
Slurry ···································································596
Selectivity······························································599
Dishing, Erosion······················································600
Pad ······································································602
Disk ······································································604
Membrane·····························································605
Retainer Ring ·························································609
Brush ··································································· 610
Filter ·····································································611

05. CMP의 미래 기술 ························································ 613


12 MI (Metrology & Inspection)

01.
Metrology ·································································621
Metrology 개론·······················································621
Device 박막 두께 측정··············································621
Device 구조/형태 측정·············································626
박막 조성/물성 측정·················································631
휨 측정··································································638

02.
Inspection·································································639
Inspection 개론·······················································639
BF/DF 검사·····························································640
파티클 카운터·························································643
매크로 검사····························································645
전자빔 검사····························································645

03.
공정 계측 응용기술······················································648
가상계측································································648
측정 검사 기술 동향과 미래······································649


13 반도체 용어해설

반도체 용어해설·································································656

종합적인 반도체 제조업체에서는 이미 패키지와 테스트에 관련된 실무 전문성 있는 책자를 2020년에 발간한 바 있으며 본 책자는 그 후속편이라 할 수 있겠습니다.

이 책자가 반도체업에 종사하는 모든 분들께 도움이 될 것으로 생각하며 특히 메모리 반도체인 DRAM과 NAND의 기본적인 이해 및 FabFabrication,

반도체 공장의 제조공정과 각종 장비에 대한 궁금증 또는 필요성이 있는 직접 관련 업무의 종사자분들, 반도체 산업의 기반이라 할 수있는 재료, 부품, 장비업에 종사하시는 분들,

그리고 교육 현장에서 학생들을 가르치시는 선생님들과 미래의 반도체 세계최고 전문가를 꿈꾸는 대한민국의 많은 희망들께 도움이 될 것으로 기대합니다.


다만 한 가지 아쉬운 점은 산업 보안 등의 이유로 저자들이 담고자 했던 내용들을 온전히 담지 못한것이며, 이에 대해서는 독자 여러분들의 넓은 이해를 구하고자 합니다.