01 Semiconducteur

Comprendre le test




01.
Post-traitement des semi-conducteurs ················································································ 5

02.
Types de tests· ...

03.
Tests sur plaquettes ········································································ 10

EPM ·· ...

Rodage de la plaquette················································································ 13

Test ·························································································· 14

Réparation· ...

04.
Tests d'emballage ······································································· 16

TDBI · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · 17

Test ························································································· 18

Inspection visuelle························································································ 18




02 Semiconducteur
Définition et rôle des paquets




01.
Définition du boîtier semi-conducteur····························································· 25

02.
Le rôle des boîtiers de semi-conducteurs ············································ 26

03.
Tendances en matière de développement des boîtiers de semi-conducteurs··············· 28

04.
Processus de développement des boîtiers de semi-conducteurs ········································ 31




03 Semiconducteur

Type d'emballage




01.
Classification des boîtiers de semi-conducteurs· ...

02.
Emballage conventionnel····································································41

Boîtiers en plastique - Boîtiers de type cadre de connexion···························41

Emballages plastiques - Emballages de type substrat ··················· 43

Emballage en céramique ·· ...

03.
Conditionnement au niveau de la plaquette····················································································· 47

Conditionnement au niveau de la plaquette ················································································· 47

Recâblage· ...

Flip Chips ·· ...

04.
Emballage plastifié· ...

Empilage de colis ············································································ 67

Empilage de puces - Empilage de puces avec liaison filaire··············· 70

Interconnexion traversante en silicium (TSV) - Empilement de puces avec TSV ··············· 73

05.
Système dans l'emballage· ...




04 Semiconducteur

Conception et analyse des emballages




01.
Conception de boîtiers pour semi-conducteurs ·················································································· 97

02.
Analyse structurale· ...

Analyse de la flexion· ...

Fiabilité des joints de soudure ··············································································· 106

Analyse des forces· ...

03.
Analyse thermique ·· ...

04.
Interprétation électrique ········································································113




05 Semiconducteur
processus d'emballage




01.
Procédé d'emballage conventionnel·························································123

Retouche arrière ·····················································124

Découpe de plaquettes······················································127

Fixation de la matrice ···································································131

Interconnexion·····································································137

Moulage·····················································································143

Marquage·································································144

Élagage - Cadre de connexion··························································146

Placage de soudure - Cadre de connexion······································147

Moulage - Cadre de connexion···························································147

Montage par billes de soudure - Substrat ························148

Singulation - Substrat ················152

02.
Procédé d'encapsulation au niveau de la plaquette···················································153

Procédé photographique ·······································································156

Procédé de pulvérisation cathodique ···················································· 161

Procédé de galvanoplastie ··················································163

Procédé humide - Bande PR et gravure métallique ····················166

Processus WLCSP avec ventilateur···························································167

Procédé de montage des billes de soudure·············································168

Procédé de micro-boîtier Flip Chip ··························································169

Processus de recâblage ·································································171

Processus WLCSP de diffusion··························································172

Procédé d'encapsulation de silicium à travers les électrodes··············· 174

03.
Inspection et mesure·······················································187

Inspection································································187

Mesure···················································································192




06 Semiconducteur
Matériaux d'emballage




01.
Matériaux d'emballage conventionnels························································ 208

Cadre conducteur ········································································· 208

Substrat· ...

Adhésif· ...

Composé de moulage époxy························································ 222

Soudure ························································································· 225

Bande· ...

Fil ····················································································· 229

Matériaux d'emballage ············································································ 230

02.
Matériaux d'encapsulation au niveau de la plaquette····································································· 231

Photorésine ·························································································· 231

Solution de placage··············································································· 234

RP Stripper······································································· 235

Agent· ...

Cible de pulvérisation cathodique ········································································ 238

Sous-remplissage· ...

Supports, adhésifs et rubans de montage·········································· 240




07 Semiconducteur
fiabilité de l'emballage



01.
Signification de la fiabilité ·· ...

02. Normes JEDEC ·· ...

03.
Tests de fiabilité en cours de vie· ...

EFR ······ · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · 253

HTOL ···························································· ····························································· 254

LTOL ·· ...

HTSL ·· ...

LTSL···················································· 257

Endurance ·· ...

Conservation des données············································································ 258

04.
Essais de fiabilité environnementale···································································· 259


Préconditionnement································································ 259

TC ·· ...

TS ·· ...

THS·························································································· 268

PCTP · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · 269

UHAST ·························································· ·························································· 270

HAST························································································· 271

HALT········································································ 272

05.
Essais de fiabilité mécanique············································ 273

Choc.................................................................................274

Vibration· ...

Flexion ·································································· 275

Twist·················································································276




08 Semiconducteur
Glossaire



Glossaire des termes············································································ 282